The development of a polyimide and metals multi-user surface micro-machining
process for Micro-electro-mechanical Systems (MEMS) is presented. The process was
designed to be as general as possible, and designed to be capable to fabricate different
designs on a single silicon wafer. The process was not optimized with the purpose
of fabricating any one specific device but can be tweaked to satisfy individual needs
depending on the application.
The fabrication process uses Polyimide as the structural material and three separated
metallization layers that can be interconnected depending on the desired application.
The technology allows the development of out-of-plane compliant mechanisms,
which can be combined with six variations of different physical principles for
actuation and sensing on a single processed silicon wafer. These variations are: electrostatic motion, thermal bimorph actuation, capacitive sensing, magnetic sensing,
thermocouple-based sensing and radio frequency transmission and reception.
|Date of Award||Nov 2016|
- Computer, Electrical and Mathematical Science and Engineering
|Supervisor||Ian Grant Foulds (Supervisor) & Jurgen Kosel (Supervisor)|
- Multi-user processes