Over the last few years, flexible electronic systems have gained increased attention
from researchers around the world because of their potential to create new
applications such as flexible displays, flexible energy harvesters, artificial skin, and
health monitoring systems that cannot be integrated with conventional wafer based
complementary metal oxide semiconductor processes. Most of the current efforts to
create flexible high performance devices are based on the use of organic
semiconductors. However, inherent material's limitations make them unsuitable for
big data processing and high speed communications.
The objective of my doctoral dissertation is to develop integration processes that
allow the transformation of rigid high performance electronics into flexible ones
while maintaining their performance and cost. In this work, two different techniques
to transform inorganic complementary metal-oxide-semiconductor electronics into
flexible ones have been developed using industry compatible processes. Furthermore,
these techniques were used to realize flexible discrete devices and circuits which
include metal-oxide-semiconductor field-effect-transistors, the first demonstration of
flexible Fin-field-effect-transistors, and metal-oxide-semiconductors-based circuits.
Finally, this thesis presents a new technique to package, integrate, and interconnect
flexible high performance electronics using low cost additive manufacturing techniques such as 3D printing and inkjet printing. This thesis contains in depth studies on electrical, mechanical, and thermal properties of the fabricated devices.
|Date of Award||Sep 2016|
- Computer, Electrical and Mathematical Science and Engineering
|Supervisor||Muhammad Mustafa Hussain (Supervisor)|
- Flexible Silicon
- High performance electronics
- Flexible packaging