Wireless interconnect between on-chip and LTCC antennas for system-in-package applications

A. Shamim*, M. Arsalan, L. Roy

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

7 Scopus citations

Abstract

A novel System-in-Package (SiP) implementation is presented for a transmitter (TX) module which makes use of electromagnetic coupling between the TX chip and package antennas at 5.2 GHz. The TX chip is realized in 0.13 μ m CMOS process and comprises an on-chip antenna. This on-chip antenna serves as the oscillator's inductor as well. The TX chip is housed in a Low Temperature Co-fired Ceramic (LTCC) package with a patch antenna. The on-chip antenna feeds the LTCC patch antenna through aperture coupling, thus negating the need for RF buffer amplifiers, matching elements, baluns, bond wires and package transmission lines. This first ever combination of on-chip and LTCC antennas increases the gain of the module by 32 dB and range by 23 m with respect to the on-chip antenna alone, without deteriorating the circuit performance and power consumption.

Original languageEnglish (US)
Title of host publicationProceedings of the 1st European Wireless Technology Conference, EuWiT 2008
Pages21-24
Number of pages4
StatePublished - 2008
Externally publishedYes
Event1st European Wireless Technology Conference, EuWiT 2008 - Amsterdam, Netherlands
Duration: Oct 27 2008Oct 31 2008

Other

Other1st European Wireless Technology Conference, EuWiT 2008
CountryNetherlands
CityAmsterdam
Period10/27/0810/31/08

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Electrical and Electronic Engineering

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