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Topography study on 45nm CuCMP low-k process and its impact on defectivity and resistance
Feng Zhao*, Benfu Lin, Hong Yu, San Leong Lup, Xianbin Wang, Mei Sheng Zhou, Haigou Huang, Hong Wu, Fan Zhang, Jun Chen, Chao Zhang Bei
*Corresponding author for this work
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review