Through wafer via hole by reactive ion etching of GaAs

Y. W. Chen*, C. L. Tan, Boon Ooi, K. Radhakrishnan, G. I. Ng

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

2 Scopus citations

Fingerprint

Dive into the research topics of 'Through wafer via hole by reactive ion etching of GaAs'. Together they form a unique fingerprint.