Thin films based on benzophenontetracarboxylic dianhydride and 4,4'-diamino-3,3'-dimethyldiphenylmethane

Ion Sava*, Stefan Chisca, Maria Brumǎ, Gabriela Lisa, Cristina Buiculescu

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The thermal treatment of polyamidic acid films based on benzophenontetracarboxylic dianhydride and 4,4'-diamino-3,3'-dimethyl diphenylmethane, at different temperatures, led to polyimide structures having different degree of imidization. The thermal and dielectric characteristics of the films were investigated by using dynamic mechanical analysis, contact angles and dielectric spectroscopy measurements.

Original languageEnglish (US)
Title of host publication2010 33rd International Semiconductor Conference, CAS 2010 - Proceedings
Pages305-308
Number of pages4
DOIs
StatePublished - Dec 1 2010
Event2010 33rd International Semiconductor Conference, CAS 2010 - Sinaia, Romania
Duration: Oct 11 2010Oct 13 2010

Publication series

NameProceedings of the International Semiconductor Conference, CAS
Volume2

Conference

Conference2010 33rd International Semiconductor Conference, CAS 2010
CountryRomania
CitySinaia
Period10/11/1010/13/10

Keywords

  • Polyamidic acid
  • Polyimides
  • Thermal treatment
  • Thin films

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

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