Thermodynamic modelling of a solid state thermoelectric cooling device: Temperature-entropy analysis

A. Chakraborty, B. B. Saha, S. Koyama, Kim Choon NG*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

62 Scopus citations

Abstract

This article presents the temperature-entropy analysis, where the Thomson effect bridges the Joule heat and the Fourier heat across the thermoelectric elements of a thermoelectric cooling cycle to describe the principal energy flows and performance bottlenecks or dissipations. Starting from the principles of thermodynamics of thermoelectricity, differential governing equations describing the energy and entropy flows of the thermoelectric element are discussed. The temperature-entropy (T-S) profile in a single Peltier element is pictured for temperature dependent Seebeck coefficient and illustrated with data from commercial available thermoelectric cooler.

Original languageEnglish (US)
Pages (from-to)3547-3554
Number of pages8
JournalInternational Journal of Heat and Mass Transfer
Volume49
Issue number19-20
DOIs
StatePublished - Sep 1 2006

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Mechanical Engineering
  • Fluid Flow and Transfer Processes

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