TDDB Reliability Improvement of Cu Damascene with a Bilayer-Structured α-SiC: H Dielectric Barrier

Chiu Chih Chiang*, Mao Chieh Chen, Zhen Cheng Wu, Lain Jong Li, Syun Ming Jang, Chen Hua Yu, Mong Song Liang

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

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