Studies on failure mechanism of ET high Via resistance in wafer fabrication

Hua Younan*, Tan Sock Khim, Kun Li, Siping Zhao

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this paper, an ET high Via resistance case was investigated. TEM/EDX technique was used for identification of the root cause. Failure mechanism of Al fluoride defects is discussed. Some preventive actions/solutions were implemented to improve the process margin and eliminate the problem.

Original languageEnglish (US)
Title of host publicationICSE 2006
Subtitle of host publication2006 IEEE International Conference on Semiconductor Electronics, Proceedings
Pages884-886
Number of pages3
DOIs
StatePublished - Dec 1 2006
Event2006 IEEE International Conference on Semiconductor Electronics, ICSE 2006 - Kuala Lumpur, Malaysia
Duration: Nov 29 2006Dec 1 2006

Publication series

NameIEEE International Conference on Semiconductor Electronics, Proceedings, ICSE

Other

Other2006 IEEE International Conference on Semiconductor Electronics, ICSE 2006
CountryMalaysia
CityKuala Lumpur
Period11/29/0612/1/06

ASJC Scopus subject areas

  • Engineering(all)

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