STEM imaging applications in deep-sub-micron failure analysis and process characterization

Kun Li, E. Er, S. Redkar

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

STEM imaging applications in deep-sub-micron failure analysis and process characterization have been discussed.

Original languageEnglish (US)
Title of host publicationProceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2003
EditorsPhilip Ho, Daniel Chan, Alastair Trigg, John Thong
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages206-209
Number of pages4
ISBN (Electronic)0780377222
DOIs
StatePublished - Jan 1 2003
Event10th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2003 - Singapore, Singapore
Duration: Jul 11 2003 → …

Publication series

NameProceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
Volume2003-January

Other

Other10th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2003
CountrySingapore
CitySingapore
Period07/11/03 → …

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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