A multilayer transition and balanced power divider are presented for millimeter-wave system-on-package (SoP). These two components operate at Ka-band and exploit the substrate integrate waveguide (SIW) technology with its shielding characteristics and the Low-temperature co-fired ceramics (LTCC) technology for its high density integration. A coupling slot has been used to perform vertical integration, which can be easily optimized through its length. The measured input return loss within the bandwidth of interest (32 GHz-38 GHz) is less than -15 dB and -18 dB for the multilayer transition and the power divider, respectively. The lateral dimensions of a multilayer system, such as a feed network of an array, can be greatly reduced by employing these 3D slot-coupled components. © 2013 IEEE.
|Original language||English (US)|
|Title of host publication||2013 IEEE MTT-S International Microwave Symposium Digest (MTT)|
|Publisher||Institute of Electrical and Electronics Engineers (IEEE)|
|State||Published - Jun 2013|