Room-temperature soldering with nanostructured foils

J. Wang*, E. Besnoin, A. Duckham, S. J. Spey, M. E. Reiss, O. M. Knio, M. Powers, M. Whitener, T. P. Weihs

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

187 Scopus citations

Abstract

The exothermic reactions in the nanostructured aluminum (Al)/nickle (Ni) multilayer foils were analyzed. The room-temperature soldering of stainless steel specimens using Al/Ni foils was also studied. X-ray diffraction, differential scanning calorimetry and optical measurements were used to characterize the products, heats and the velocities of the reactions. The results show a tensile shear strength of 48 MPa for the reactive foil joints as compared to 38 MPa for conventional joints.

Original languageEnglish (US)
Pages (from-to)3987-3989
Number of pages3
JournalApplied Physics Letters
Volume83
Issue number19
DOIs
StatePublished - Nov 10 2003
Externally publishedYes

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

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