Room temperature hermetic sealing of microelectronic packages with nanoscale multilayer reactive foils

M. Powers*, J. Subramanian, J. Levin, T. Rude, D. Van Heerden, O. Knio

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Hermetic sealing of microelectronic packages was performed using a room temperature, fluxless soldering process that is based on the use of a reactive multilayer foil as a local heat source. The multilayer foil consists of thousands of alternating nanoscale layers comprised of elements with large negative heats of mixing, such as Al and Ni. The foil is sandwiched between freestanding sheets of solder and the solder/reactive foil assembly is positioned between the package housing and lid. A self-propagating reaction within the foil is then initiated using a small thermal or electrical pulse. Heat generated by the reaction melts the solder preforms on either side of the reactive foil and consequently bonds the components. This process is completed within a few milliseconds and results in a solder based hermetic seal between the package base and the lid. Reactive multilayer joining is shown to be a viable alternative to laser welding and furnace reflow soldering for hermetic sealing of hybrid microelectronic packages.

Original languageEnglish (US)
Title of host publicationMaterials Science and Technology 2005 - Proceedings of the Conference
Pages61-68
Number of pages8
Volume3
StatePublished - 2005
Externally publishedYes
EventMaterials Science and Technology 2005 Conference - Pittsburgh, PA, United States
Duration: Sep 25 2005Sep 28 2005

Other

OtherMaterials Science and Technology 2005 Conference
CountryUnited States
CityPittsburgh, PA
Period09/25/0509/28/05

Keywords

  • Hermetic sealing
  • Lead-free
  • Room temperature process

ASJC Scopus subject areas

  • Engineering(all)

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