Response of MEMS devices under shock loads

Mohammad I. Younis*, Ronald Miles

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

5 Scopus citations

Abstract

There is strong experimental evidence for the existence of strange modes of failure of MEMS devices under shock. Such failures have not been explained with conventional models of MEMS. These failures are characterized by overlaps between moving microstructures and stationary electrodes, which cause electrical shorts. This work presents a model and simulation of MEMS devices under the combination of shock loads and electric actuation, which will shed the light on the influence of these forces on the pull-in instability. Our results indicate that the reported strange failures can be attributed to early dynamic pull-in instability. The results show that the combination of a shock load and an electric actuation makes the instability threshold much lower than the threshold predicted considering the effect of shock alone or electric actuation alone. Several results are presented showing the response of MEMS devices due to half-sine pulse, triangle pulse, and rectangular pulse shock loads of various durations and strengths. The effects of linear viscous damping and incompressible squeeze-film damping are also investigated.

Original languageEnglish (US)
Title of host publicationProceedings of the ASME Design Engineering Division 2005
PublisherAmerican Society of Mechanical Engineers (ASME)
Pages499-505
Number of pages7
Volume118 A
Edition1
DOIs
StatePublished - 2005
Externally publishedYes
Event2005 ASME International Mechanical Engineering Congress and Exposition, IMECE 2005 - Orlando, FL, United States
Duration: Nov 5 2005Nov 11 2005

Other

Other2005 ASME International Mechanical Engineering Congress and Exposition, IMECE 2005
CountryUnited States
CityOrlando, FL
Period11/5/0511/11/05

ASJC Scopus subject areas

  • Control and Systems Engineering

Fingerprint

Dive into the research topics of 'Response of MEMS devices under shock loads'. Together they form a unique fingerprint.

Cite this