Quantitative comparison of adhesive toughness for various diamond films on co-cemented tungsten carbide

Shoji Kamiya, Hironori Takahashi, Pierangelo D'Antonio, Riccardo Polini*, Enrico Traversa

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

6 Scopus citations

Abstract

A new method of quantitative evaluation for the toughness of interface between thick diamond films and Co-cemented tungsten carbide (WC-Co) substrates is reported. This new method derives from the previously developed technique, which was applied for the quantitative evaluation of the adhesive toughness of discrete diamond crystallites on Co-cemented tungsten carbide (WC-Co) substrates [S. Kamiya et al., Diamond Relat. Mater. 9 (2000) 191-194] and has been applied here to evaluate the adhesive toughness of various diamond films on WC-Co cutting inserts. The adhesive toughness was successfully obtained to be in the 15-23 J/m2 range and was depending on the morphology of the interface.

Original languageEnglish (US)
Pages (from-to)716-720
Number of pages5
JournalDiamond and Related Materials
Volume11
Issue number3-6
DOIs
StatePublished - Mar 2002
Externally publishedYes

Keywords

  • Adhesion strength
  • Chemical vapor deposition
  • Diamond coated tools
  • Tungsten carbide

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Chemistry(all)
  • Mechanical Engineering
  • Physics and Astronomy(all)
  • Materials Chemistry
  • Electrical and Electronic Engineering

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