Recent breakthroughs in memristive devices have demonstrated the potential of using resistive content addressable memories for associative processing. These architectures enable ultra-high density integrated circuits along with low-power computation. However, the reliability of memristive elements is limiting the widespread adoption of these architectures. In this study, we address the reliability issues that arise in high density, resistive associative processor architectures. We propose methods to design process variation immune resistive content addressable memories and minimize the error probabilities. According to SPICE-based circuit simulations, the reliability of the circuit increases significantly and thus positively influences the accuracy of arithmetic operations as well.
|Original language||English (US)|
|Title of host publication||Proceedings of the 34th IEEE International Conference on Computer Design, ICCD 2016|
|Publisher||Institute of Electrical and Electronics Engineers Inc.|
|State||Published - Nov 22 2016|