Process engineering and failure analysis of MEMS and MOEMS by Digital Holography Microscopy (DHM)

Frédéric Montfort*, Yves Emery, François Marquet, Etienne Cuche, Nicolas Aspert, Eduardo Solanas, Alexandre Mehdaoui, Adrian Ionescu, Christian Depeursinge

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

26 Scopus citations

Abstract

Process engineering and failure analysis of MEMS and MOEMS require static and dynamical characterization of both their in-plane and out of plane response to an excitation. A remarkable characteristic of Digital Holography Microscopes (DHM) is the extremely short acquisition time required to grab the whole information necessary to provide 3D optical topography of the sample: a unique frame grab, without any vertical or lateral scan provides the information over the full field of view. First, it ensures DHM measurements to be insensitive to vibrations. Second, it opens the door to fast dynamical characterization of micro-systems. For periodic movement analysis, DHM can operate in stroboscopic mode with standard cameras. It enables precise characterization up to excitation frequencies of 100 kHz with recovery cycle of 10% simply by triggering properly the camera. Pulsed sources can be used for investigation of higher excitation frequencies. For non periodic movement analysis fast acquisition cameras and postponed treatment are used. DHM are therefore unique and very efficient tool for dynamical characterization of in-plane and out-of-plane response. In this paper we show the basics of the technology and illustrate process engineering and failure analysis using DHM with an example of in and out of plane characterization of movements of a variable capacitor using the stroboscopic mode of acquisition.

Original languageEnglish (US)
Title of host publicationReliability, Packaging, Testing, and Characterization of MEMS/MOEMS VI
DOIs
StatePublished - Apr 30 2007
EventReliability, Packaging, Testing, and Characterization of MEMS/MOEMS VI - San Jose, CA, United States
Duration: Jan 23 2007Jan 24 2007

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume6463
ISSN (Print)0277-786X

Other

OtherReliability, Packaging, Testing, and Characterization of MEMS/MOEMS VI
CountryUnited States
CitySan Jose, CA
Period01/23/0701/24/07

Keywords

  • Digital holography microscopy
  • Dynamical analysis
  • Failure analysis
  • Interferometer resolution
  • MEMS & MOEMS

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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