Pre-bonding method using self-alignment effect for multichip packaging

Jae Hak Lee, Tae Ho Ha, Chang Woo Lee, Jun Yeob Song, Min Suk Cha, Choong Don Yoo

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

An efficient C2C/C2W oxide bonding technique using self-alignment effect of a pair of hydrophilic chip surfaces, which are activated by plasma, is applied to 3D stacking of multichip packaging in this work. Self-alignment and pre-bonding technique can provide high-speed bonding process and high-precision chip alignment accuracy simultaneously without high-precision chip manipulator. Through experiments, we could acquire high hydrophilic silicon surfaces using plasma surface activation and measured position errors and rotational error of aligned chips is smaller than 5μ and 0.04 degrees respectively because of self-alignment effect between hydrophilic surfaces of chips. In addition, temporary bonding is formed successfully by secondary bonding between silanol groups (Si-OH) on the hydrophilic silicon chip surfaces when the DI water is evaporated by heating, which prevents contamination of bonding surface and helps of manipulation of multi-stacked chips easily.

Original languageEnglish (US)
Title of host publication2009 IEEE International Symposium on Assembly and Manufacturing, ISAM 2009
Pages118-123
Number of pages6
DOIs
StatePublished - Dec 1 2009
Event2009 IEEE International Symposium on Assembly and Manufacturing, ISAM 2009 - Seoul, Korea, Republic of
Duration: Nov 17 2009Nov 20 2009

Publication series

Name2009 IEEE International Symposium on Assembly and Manufacturing, ISAM 2009

Other

Other2009 IEEE International Symposium on Assembly and Manufacturing, ISAM 2009
CountryKorea, Republic of
CitySeoul
Period11/17/0911/20/09

Keywords

  • 3D stacking
  • Hydrophilic surface
  • Multichip packaging
  • Oxide bonding
  • Self-alignment

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering

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