An exterior grade adhesive dispersion, based on ammonium spent sulfite liquor (NH//4SSL), an alkaline phenol-formaldehyde (PF) resin, and an acid catalyst was prepared and evaluated for the production of waterboard. Some of the factors affecting its curing properties included the source of NH//4SSL, the lignin to carbohydrate ratio, the molecular weight distribution of PF, and the pH. This resin appears to have considerable potential as a low-cost exterior grade adhesive for waferboard/OSB since NH//4SSL is available at a fraction of the cost of PF. Results indicate that a NH//4SSL-PF resin that contains up to 50 percent solids had curing and adhesive properties similar to commercial PF resins currently used as face resins in the industrial manufacture of 3-layer waferboards.
|Original language||English (US)|
|Number of pages||6|
|Journal||Forest Products Journal|
|State||Published - May 1 1988|
ASJC Scopus subject areas
- Materials Science(all)
- Plant Science