PRACTICAL LIGNIN-BASED ADHESIVE FOR WAFERBOARD/OSB.

L. R. Calve*, J. A. Shields, L. Blanchette, J. M.J. Frechet

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

17 Scopus citations

Abstract

An exterior grade adhesive dispersion, based on ammonium spent sulfite liquor (NH//4SSL), an alkaline phenol-formaldehyde (PF) resin, and an acid catalyst was prepared and evaluated for the production of waterboard. Some of the factors affecting its curing properties included the source of NH//4SSL, the lignin to carbohydrate ratio, the molecular weight distribution of PF, and the pH. This resin appears to have considerable potential as a low-cost exterior grade adhesive for waferboard/OSB since NH//4SSL is available at a fraction of the cost of PF. Results indicate that a NH//4SSL-PF resin that contains up to 50 percent solids had curing and adhesive properties similar to commercial PF resins currently used as face resins in the industrial manufacture of 3-layer waferboards.

Original languageEnglish (US)
Pages (from-to)15-20
Number of pages6
JournalForest Products Journal
Volume38
Issue number5
StatePublished - May 1 1988
Externally publishedYes

ASJC Scopus subject areas

  • Forestry
  • Materials Science(all)
  • Plant Science

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