Platform Isolation Using Out-of-Plane Complaint Mechanisms

A. Arevalo, E. Rawashdeh, I. G. Foulds

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper reports the structural solid mechanic simulation of a MEMS out-of-plane platform that provides thermal and electrical isolation for a device built on it. When assemble, the platform lifted for approximately 400 μm above the substrate level. A mechanical stress analysis is then presented in order to evaluate the feasibility of building it using commonly used materials in MEMS. Our analysis showed that polymeric materials such as polyimide and SU8 may undergo a localized plastic deformation but are not likely to fail upon assembly. Polysilicon on the contrary, showed high failure probability.
Original languageEnglish (US)
Title of host publicationProceedings of the 2014 COMSOL Conference in Boston
StatePublished - Oct 8 2014
Externally publishedYes

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