Plane-view transmission electron microscopy for advanced integrated circuit

Pan Liu*, K. Li, Eddie Er, Siping Zhao

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

4 Scopus citations

Abstract

In this paper, the authors try to introduce three techniques for plane-view TEM sample preparation. First, traditional plane-view TEM sample preparation will be introduced. The second technique is FIB-based lift-out method, which places the sample on the carbon film. This technique is used to cut isolated defects, such as SRAM single bit failure, but this technique introduces artifacts from FIB ion damage and carbon film. The last technique is a combination of tripod polishing, FIB milling and ion milling. Specific cases will be given to illustrate the application of these techniques.

Original languageEnglish (US)
Title of host publicationICSE 2006
Subtitle of host publication2006 IEEE International Conference on Semiconductor Electronics, Proceedings
Pages630-633
Number of pages4
DOIs
StatePublished - 2006
Externally publishedYes
Event2006 IEEE International Conference on Semiconductor Electronics, ICSE 2006 - Kuala Lumpur, Malaysia
Duration: Nov 29 2006Dec 1 2006

Other

Other2006 IEEE International Conference on Semiconductor Electronics, ICSE 2006
CountryMalaysia
CityKuala Lumpur
Period11/29/0612/1/06

ASJC Scopus subject areas

  • Engineering(all)

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