Out-of-plane deformable semiconductor substrate, method of making an out-of-plane deformable semiconductor substrate, and an in-plane and out-of-plane deformable semiconductor substrate

SEPULVEDA Adrián César CAVAZOS (Inventor), Muhammad Mustafa Hussain (Inventor)

Research output: Patent

Abstract

An out-of-plane deformable semiconductor substrate includes a plurality of rigid portions having a first thickness and an out-of-plane deformable portion having a second thickness and connecting the plurality of rigid portions to each other. The second thickness is smaller than the first thickness. The out-of-plane deformable semiconductor substrate is monolithic.
Original languageEnglish (US)
Patent numberWO2018096454A1
StatePublished - May 31 2018

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