Multi-Dimensional Integration and Packaging of Devices for Internet-of-Things Applications

Nazek Elatab, Reema Suwaidan, Yara Alghamdi, Alhanouf Alhazzany, Reema Almansour, Sohail F. Shaikh, Sherjeel M. Khan, Muhammad Mustafa Hussain

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

IoT applications are increasingly becoming widespread with more stringent system requirements. In this work, we demonstrate a nature-inspired integration and packaging technology that achieves self-powered multi-functional systems with optimized performance and small footprint area. The integration technique is based on bifacial usage of the substrate where devices on both sides are interconnected via through-substrate-vias. Multiple substrates are then integrated and folded into a 3D architecture using side-interlocks following a puzzle-like fashion. On the outer sides of the 3D architecture, sensors, RF devices and energy harvesters are integrated while on the inner faces, a solid-state battery in addition to power- management and data-management circuitry are embedded. To package the system, a polymeric encapsulant is used to protect the inner circuitry and enhance the mechanical resilience of the system. Finally, the system is used to send the collected data wirelessly to a phone using an embedded Bluetooth Low Energy unit.
Original languageEnglish (US)
Title of host publication2020 IEEE 6th World Forum on Internet of Things (WF-IoT)
PublisherIEEE
ISBN (Print)9781728155036
DOIs
StatePublished - Oct 13 2020

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