Modeling and testing of an advanced compact two-phase cooler for electronics cooling

Mark Aaron Chan, Christopher R. Yap, Kim Choon NG*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

12 Scopus citations

Abstract

This paper describes the modeling, design, and testing of a high flux and yet compact two-phase CPU cooler, with excellent attributes of low thermal resistance that are derived from the intrinsic design features of phase change phenomena and minimal vapor pressure drop of the device. For the same footprint of a conventional cooler, the prototype rejects more than twice the capacity of CPUs of today. The unique design minimizes its overall size and yet provides adequate area for forced convection cooling. Testing was conducted over an assorted heat loads and air flow rates flowing through the fins, achieving a best performance of 0.206 K/W of device thermal resistance at a rating of 203 W under an air flow rate of 0.98 m3/min. The prototype device is orientation free where a 90° tilt could perform at the same rating conditions.

Original languageEnglish (US)
Pages (from-to)3456-3463
Number of pages8
JournalInternational Journal of Heat and Mass Transfer
Volume52
Issue number15-16
DOIs
StatePublished - Jul 1 2009

Keywords

  • CPU cooling
  • Enhanced nucleate boiling
  • Heat sinks
  • Porous media

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Mechanical Engineering
  • Fluid Flow and Transfer Processes

Fingerprint

Dive into the research topics of 'Modeling and testing of an advanced compact two-phase cooler for electronics cooling'. Together they form a unique fingerprint.

Cite this