Microplate modeling under coupled structural-fluidic-electrostatic forces

Mohammad I. Younis*, Ali H. Nayfeh

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

4 Scopus citations

Abstract

We present a model for the dynamic behavior of microplates under the coupled effects of squeeze-film damping, electrostatic actuation, and mechanical forces. The model simulates the dynamics of microplates and predicts their quality factors under a wide range of gas pressures and applied electrostatic forces up to the pull-in instability. The model utilizes the nonlinear Euler-Bernoulli beam equation, the linearized dynamic vonKármán plate equations, and the linearized compressible Reynolds equation. The static deflection of the microplate is calculated using the beam model. Perturbation techniques are used to derive analytical expressions for the pressure distribution in terms of the plate mode shapes around the deflected position. The static deflection and the analytical expressions are substituted into the plate equations, which are solved using a finite-element method.

Original languageEnglish (US)
Title of host publication2004 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2004
EditorsM. Laudon, B. Romanowicz
Pages251-254
Number of pages4
Volume2
StatePublished - 2004
Externally publishedYes
Event2004 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2004 - Boston, MA, United States
Duration: Mar 7 2004Mar 11 2004

Other

Other2004 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2004
CountryUnited States
CityBoston, MA
Period03/7/0403/11/04

Keywords

  • Electrostatic forces
  • Microplates
  • Quality factors
  • Squeeze-film damping

ASJC Scopus subject areas

  • Engineering(all)

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