Mechanical behavior of eutectic Sn-Ag and Sn-Zn solders

Hareesh Mavoori*, Semyon Vaynman, Jason Chin, Brian Moran, Leon M. Keer, Morris E. Fine

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

29 Scopus citations

Abstract

Eutectic Sn-Ag and Sn-Zn solders are currently being investigated as the basis for replacement of Sn-Pb solders. Some mechanical properties of these solder systems - fatigue, tensile, stress relaxation and creep are presented here along with some damage feature observations for eutectic Sn-Ag solder. Semi-empirical modeling, constitutive modeling and numerical simulation based on damage models have been carried out for lifetime prediction. Preliminary agreement of this numerical simulation with experimental results appears encouraging, but the models need further refinement.

Original languageEnglish (US)
Pages (from-to)161-175
Number of pages15
JournalMaterials Research Society Symposium - Proceedings
Volume390
StatePublished - 1995
Externally publishedYes

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

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