Lifetime prediction of solders in electronic packaging

Leon M. Keer*, Brian Moran

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The repeated mechanical loading of connecting solder joints caused by thermal cycling of electronic assemblies through differential thermal expansion among assembly members may lead to fatigue failure. The rate of fatigue damage is determined by the solder stress/strain state, temperature, frequency, hold time, and environment. Failure can be induced by defect crack propagation or yield. The mechanism of the damage is complex, especially when such materials are operating in high temperature environments, and is far from being understood. The mechanical properties may be altered due to high temperature, and different levels of the internal structure are found to take control under different conditions. In this paper, three useful methods for the investigation of fatigue of solder materials are compared. The crack behavior analysis of Subrahmanyan et al (1989), the energy approach of Vaynman and McKeown (1993), and the continuum mechanics approach of Zubelewicz (1993) for the inelastic deformation of ductile materials are discussed.

Original languageEnglish (US)
Title of host publicationAdvances in Electronic Packaging
Pages651-655
Number of pages5
Volume10-2
StatePublished - 1995
Externally publishedYes
EventProceedings of the International Intersociety Electronic Packaging Conference - INTERpack'95. Part 1 (of 2) - Maui, HI, USA
Duration: Mar 26 1995Mar 30 1995

Other

OtherProceedings of the International Intersociety Electronic Packaging Conference - INTERpack'95. Part 1 (of 2)
CityMaui, HI, USA
Period03/26/9503/30/95

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering

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