Interfacial reactions in thermoelectric modules

Hsin-jay Wu, Albert T. Wu, Pei-chun Wei, Sinn-wen Chen

Research output: Contribution to journalArticlepeer-review

6 Scopus citations

Abstract

Engineering transport properties of thermoelectric (TE) materials leads to incessantly breakthroughs in the zT values. Nevertheless, modular design holds a key factor to advance the TE technology. Herein, we discuss the structures of TE module and illustrate the inter-diffusions across the interface of constituent layers. For Bi2Te3-based module, soldering is the primary bonding method, giving rise to the investigations on the selections of solder, diffusion barrier layer and electrode. For mid-temperature PbTe-based TE module, hot-pressing or spark plasma sintering are alternative bonding approaches; the inter-diffusions between the diffusion barrier layer, electrode and TE substrate are addressed as well.
Original languageEnglish (US)
Pages (from-to)244-248
Number of pages5
JournalMaterials Research Letters
Volume6
Issue number4
DOIs
StatePublished - Feb 20 2018

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