Interface characterization of nickel contacts to bulk bismuth tellurium selenide

O. D. Iyore, T. H. Lee, R. P. Gupta, J. B. White, Husam Niman Alshareef, M. J. Kim, B. E. Gnade

Research output: Contribution to journalArticlepeer-review

45 Scopus citations

Abstract

Transmission electron microscopy (TEM) characterization of nickel contacts to bulk bismuth tellurium selenide [Bi2(Te, Se)3] is reported. Samples were prepared in a dual column focused ion beam/scanning electron microscope (FIB/SEM) system using a lift-out technique, with ion beam energy and exposure times carefully optimized to minimize sample damage. Diffusion of Ni into Bi2(Te, Se)3 was observed and the formation of a nickel telluride (NiTe) interfacial region confirmed after heat treatment at 200 °C. Selected area diffraction patterns provided evidence of a modified bismuth telluride-like structure at the interface, identified by analytical electron microscopy to be composed of Ni and Bi2(Te, Se)3.

Original languageEnglish (US)
Pages (from-to)440-444
Number of pages5
JournalSurface and Interface Analysis
Volume41
Issue number5
DOIs
StatePublished - May 1 2009

Keywords

  • Electron energy loss spectroscopy
  • Focused ion beam
  • Thermoelectric materials
  • Transmission electron microscopy
  • X-ray diffraction

ASJC Scopus subject areas

  • Chemistry(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry

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