Highly Manufacturable Deep (Sub-Millimeter) Etching Enabled High Aspect Ratio Complex Geometry Lego-Like Silicon Electronics

Mohamed T. Ghoneim, Muhammad Mustafa Hussain

Research output: Contribution to journalArticlepeer-review

9 Scopus citations

Abstract

A highly manufacturable deep reactive ion etching based process involving a hybrid soft/hard mask process technology shows high aspect ratio complex geometry Lego-like silicon electronics formation enabling free-form (physically flexible, stretchable, and reconfigurable) electronic systems.
Original languageEnglish (US)
Pages (from-to)1601801
JournalSmall
Volume13
Issue number16
DOIs
StatePublished - Feb 1 2017

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