Highly Efficient Full-Color Inorganic LEDs on a Single Wafer by Using Multiple Adhesive Bonding

Seung-Hyun Mun, Chang-Mo Kang, Jung-Hong Min, Soo-Young Choi, Woo-Lim Jeong, Gi-Gwan Kim, Je-Sung Lee, Kyung-Pil Kim, Heung Cho Ko, Dong-Seon Lee

Research output: Contribution to journalArticlepeer-review

Abstract

Monolithic integration is a promising way to realize full-color high-resolution displays. However, it is still a challenge to realize a highly efficient full-color light-emitting diode (LED) adopting color conversion layer. In this work, red, green, and blue inorganic LED thin films grown on respective substrates for high-quality epitaxial layers are integrated on a single substrate using a multiple adhesive bonding technique. It is verified that the stacked thin films are structurally stable. After the multiple bonding, respective subpixels are formed by using standard photolithography only without a mass transfer process, showing the possibility of applying them to a high-resolution micro-LED display. Even after the bonding, the device still maintains high efficiency without deteriorating performance. The integrated subpixels are not only independently operated by controlling input power, but the light emission can also cover a wide range of the color space, about 83% compared to Rec.2020 color space.
Original languageEnglish (US)
Pages (from-to)2100300
JournalAdvanced Materials Interfaces
DOIs
StatePublished - Jun 27 2021

ASJC Scopus subject areas

  • Mechanics of Materials
  • Mechanical Engineering

Fingerprint

Dive into the research topics of 'Highly Efficient Full-Color Inorganic LEDs on a Single Wafer by Using Multiple Adhesive Bonding'. Together they form a unique fingerprint.

Cite this