In this paper, fan-pad metallization and trench patterning were introduced in 850 nm Vertical-Cavity Surface-Emitting Laser (VCSEL) device packaging. Low threshold current and series resistance, which contributes to higher VCSEL efficiency, are obtained for the VCSEL with fan-metallization and trench patterning fabricated devices. Further, the output spectral characteristics show stable multimode operation for these devices. The results indicate that the proposed VCSEL packaging exhibits superior device performance compared to typical packaged VCSEL with square-pad metal.
|Original language||English (US)|
|Journal||Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium|
|State||Published - 2008|
ASJC Scopus subject areas
- Industrial and Manufacturing Engineering
- Electrical and Electronic Engineering