A novel CMOS-enabled heterogeneous integration and packaging technology based on multi-dimensional (MD) integration of thin-film components to combine between the best of SoC IC integration and best of SiP package integration is demonstrated. As a proof-of-concept, we demonstrate a prototype of a cubic MD-IC (4D system) that includes multi-functional sensors, antenna, microcontroller, light-emitting-diode (LED), a micro-lithium-ion battery and a solar cell. Devices are fabricated on both sides of each substrate (Si, Ge and GaSb) and are interconnected using through-silicon-vias (TSVs) and side interlocks. PDMS encapsulation shows improved mechanical performance. The resulting system is a complete, multi-functional, lightweight, high-performance and compact packaged system. The MD-IC package passed preliminary component-level and system-level reliability tests. Finally, the MD-IC provides an enhanced yield and cost of the system due to the capability to fabricate and test smaller dies separately before integrating them into a complete package.