Hermetic sealing of microelectronics packages using a room temperature soldering process

T. Rude*, J. Subramanian, J. Levin, D. Van Heerden, O. Knio, M. Powers

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

4 Scopus citations

Abstract

This paper describes a process which uses a multilayered reactive foil to hermetically seal microelectronic packages. The foil is comprised of thousands of nanoscale layers of elements with large negative heats of mixing, such as Al and Ni. When the reaction is activated in the foil using a small electrical or thermal stimulus, the heat generated melts the adjoining solder layers and permanently joins the package lid to the base. The seal is achieved without exposing the components to high reflow temperature. RNT has used this process to create a hermetic seal between an Au-plated stainless steel lid and Au-plated stainless steel base. We show that helium leak rates of less than 1 × 10-10 atm-cc/sec can be achieved by using this method. This process provides an attractive alternative to more expensive methods such as laser welding and eliminates the need for costly fabrication equipment.

Original languageEnglish (US)
Title of host publicationProceedings - 2005 International Symposium on Microelectronics, IMAPS 2005
Pages286-290
Number of pages5
StatePublished - 2005
Externally publishedYes
Event38th International Symposium on Microelectronics, IMAPS 2005 - Philadelphia, PA, United States
Duration: Sep 25 2005Sep 29 2005

Other

Other38th International Symposium on Microelectronics, IMAPS 2005
CountryUnited States
CityPhiladelphia, PA
Period09/25/0509/29/05

Keywords

  • Flux free
  • Hermetic sealing
  • Reactive multilayer foil
  • Room temperature process

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this