Heatsink Allowing In-Situ Maintenance in a Stackable Module

R El-Essawy Wael (Inventor), N Elnozahy Elmootazbellah (Inventor), K Iyengar Madhusudan (Inventor), W Keller, Jr. Thomas (Inventor), C Rubio Juan (Inventor)

Research output: Patent

Abstract

A modular processing module allowing in-situ maintenance is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors, and a plurality of processing nodes. Each processing module side couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system and at least one heatsink that couples to at least a portion of the plurality of processing nodes on one of the processing module sides and is designed such that, when a set of heatsinks in the modular processing module are installed, an empty space is left in a center of the modular processing module.

Original languageEnglish (US)
Patent numberUS2012320524
IPCG06F 1/ 20 A I
Priority date08/28/12
StatePublished - Dec 20 2012
Externally publishedYes

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