Guest Editorial Antenna-in-Package, Antenna-on-Chip, Antenna-IC Interface: Joint Design and Cointegration

Wonbin Hong, Rob Maaskant, Duixian Liu, Hua Wang, Atif Shamim, Bart Smolders, DIrk Manteuffel, Yueping Zhang

Research output: Contribution to journalArticlepeer-review

1 Scopus citations

Abstract

The twenty peer-reviewed letters in this special section examine the design and cointegration of antenna-in-package (AiP), antenna-on-chip (AoC), and antenna ICs (AIC). The letters are categorized in the four distinctive categories: 1) Fabrication technologies (four); 2) Measurement strategies; 3) Applications; and 4) New design and integration strategies. Fruition of major thrusts such as 5G/6G, high-resolution radar and imaging, autonomous driving, and space technology are highly intertwined with the advance of applied electromagnetics. Miniaturization and seamless integration of microwave components and radio systems can enable superior performance, form factor, and cost efficiencies leading to enhanced proliferation of such applications. Historically, radio frequency front ends, antennas, and microwave components have separately evolved using distinct fabrication and measurement technologies.
Original languageEnglish (US)
Pages (from-to)2345-2350
Number of pages6
JournalIEEE Antennas and Wireless Propagation Letters
Volume18
Issue number11
DOIs
StatePublished - Nov 5 2019

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