Gas-Phase Modification of Polymer Coatings: The Use of Gas-Phase Silylation for Image-Tone Reversal of Chemically Amplified Photoresists Based on Electrophilic Addition Reactions

S. Ming Lee, Stephen Matuszczak, Jean Frechet*, Chester Lee, Yosef Shacham-Diamand

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

3 Scopus citations

Abstract

Image-tone reversal has been demonstrated with two chemically amplified resists through gas-phase silylation and dry development with oxygen plasma etching. Selective silylation of the radiation-exposed or unexposed portions of the resists has been achieved by two different approaches: (a) controlling the availability of the reactive groups; (b) varying the permeability of the resist material to the silylating reagent. Those areas of the resist films that are silylated resist oxygen plasma etching. This provides access to high-resolution images with the high sensitivity of the chemically amplified resists. Techniques useful to monitor the silylation process and factors affecting the silylation and etching processes are discussed.

Original languageEnglish (US)
Pages (from-to)1796-1802
Number of pages7
JournalChemistry of Materials
Volume6
Issue number10
DOIs
StatePublished - Oct 1 1994

ASJC Scopus subject areas

  • Chemistry(all)
  • Chemical Engineering(all)
  • Materials Chemistry

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