Enhanced cooling in mono-crystalline ultra-thin silicon by embedded micro-air channels

Mohamed T. Ghoneim, Hossain M. Fahad, Aftab M. Hussain, Jhonathan Prieto Rojas, Galo T. Sevilla, Nasir Alfaraj, Ernesto B. Lizardo, Muhammad Mustafa Hussain

Research output: Contribution to journalArticlepeer-review

8 Scopus citations

Abstract

In today’s digital world, complementary metal oxide semiconductor (CMOS) technology enabled scaling of bulk mono-crystalline silicon (100) based electronics has resulted in their higher performance but with increased dynamic and off-state power consumption. Such trade-off has caused excessive heat generation which eventually drains the charge of battery in portable devices. The traditional solution utilizing off-chip fans and heat sinks used for heat management make the whole system bulky and less mobile. Here we show, an enhanced cooling phenomenon in ultra-thin (>10 μm) mono-crystalline (100) silicon (detached from bulk substrate) by utilizing deterministic pattern of porous network of vertical “through silicon” micro-air channels that offer remarkable heat and weight management for ultra-mobile electronics, in a cost effective way with 20× reduction in substrate weight and a 12% lower maximum temperature at sustained loads. We also show the effectiveness of this event in functional MOS field effect transistors (MOSFETs) with high-κ/metal gate stacks.
Original languageEnglish (US)
Pages (from-to)127115
JournalAIP Advances
Volume5
Issue number12
DOIs
StatePublished - Dec 11 2015

Fingerprint Dive into the research topics of 'Enhanced cooling in mono-crystalline ultra-thin silicon by embedded micro-air channels'. Together they form a unique fingerprint.

Cite this