Engineering kinetic barriers in copper metallization

Hanchen Huang*, H. L. Wei, C. H. Woo, Xixiang Zhang

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

25 Scopus citations

Abstract

The method to improve quality of deposited copper films was discussed by using magnetron sputtering technique. The structure and texture of the film was characterized by using the SEM and X-ray diffraction analysis. The results showed that the quality of the film was improved by the reduction of three dimensional Ehrlich-Schwoebel barrier.

Original languageEnglish (US)
Pages (from-to)4359-4361
Number of pages3
JournalApplied Physics Letters
Volume81
Issue number23
DOIs
StatePublished - Dec 2 2002

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

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