Embedding complex objects with 3d printing

Mustafa HUSSAIN, Muhammad (Inventor), Steven DIAZ CORDERO, Marlon (Inventor)

Research output: Patent

Abstract

A CMOS technology-compatible fabrication process for flexible CMOS electronics embedded during additive manufacturing (i.e. 3D printing). A method for such a process may include printing a first portion of a 3D structure; pausing the step of printing the 3D structure to embed the flexible silicon substrate; placing the flexible silicon substrate in a cavity of the first portion of the 3D structure to embed the flexible silicon substrate in the 3D structure; and resuming the step of printing the 3D structure to form the second portion of the 3D structure.
Original languageEnglish (US)
Patent numberWO 2017175159 A1
IPCH01L 33/ 48 A I
Priority date04/8/16
StatePublished - Oct 12 2017

Bibliographical note

KAUST Repository Item: Exported on 2018-05-13

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