Electrothermal modeling, fabrication and analysis of low-power consumption thermal actuator with buckling arm

Hongyun So, Albert P. Pisano

Research output: Contribution to journalArticlepeer-review

10 Scopus citations

Abstract

© 2013, Springer-Verlag Berlin Heidelberg. This paper reports on a novel thermal actuator with sub-micron metallic structures and a buckling arm to operate with low voltages and to generate very large deflections, respectively. A lumped electrothermal model and analysis were also developed to validate the mechanical design and easily predict the temperature distribution along arms of the sub-micron actuator. The actuator was fabricated via the combination of electron beam lithography to form actuator arms with a minimum feature size of 200 nm and lift-off process to deposit a high aspect ratio nickel structure. Reproducible displacements of up to 1.9 μm at the tip were observed up to 250 mV under confocal microscope. The experimentally measured deflection values and theoretically calculated temperature distribution by the developed model were compared with finite element analysis results and they were in good agreement. This study shows a promising approach to develop more sophisticated nano actuators required larger deflections for manipulation of sub-micron scale objects with low-power consumption.
Original languageEnglish (US)
Pages (from-to)195-202
Number of pages8
JournalMicrosystem Technologies
Volume21
Issue number1
DOIs
StatePublished - Oct 31 2013
Externally publishedYes

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