Effects of wafer-level packaging on millimetre-wave antennas

Hattan Abutarboush, Hani H. Tawfik, Ezzeldin A. Soliman, Mai O. Sallam, Atif Shamim, Sherif M. Sedky

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A cost-effective antenna package suitable for mass production mm-wave applications is investigated. Different packaging material that can be possibly used in mm-wave antennas are presented and compared. Moreover, this study investigates different methods of packaging millimetre-wave (60 GHz) MEMS antennas. The paper first introduces the custom needs for optimum operation of the MEMS antenna and then examines the current available enabling technologies for packaging. The sensitivity of the antenna's reflection coefficient, gain and radiation efficiency to the packaging environment is investigated through EM simulations. © 2011 IEEE.
Original languageEnglish (US)
Title of host publication2011 Loughborough Antennas & Propagation Conference
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
ISBN (Print)9781457710155
DOIs
StatePublished - Nov 2011

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