Discontinuous Galerkin Time-Domain Analysis of Power-Ground Planes Taking Into Account Decoupling Capacitors

Ping Li, Li Jun Jiang, Hakan Bagci

Research output: Contribution to journalArticlepeer-review

7 Scopus citations

Abstract

In this paper, a discontinuous Galerkin time-domain (DGTD) method is developed to analyze the power-ground planes taking into account the decoupling capacitors. In the presence of decoupling capacitors, the whole physical system can be split into two subsystems: 1) the field subsystem that is governed by Maxwell's equations that will be solved by the DGTD method, and 2) the circuit subsystem including the capacitor and its parasitic inductor and resistor, which is going to be characterized by the modified nodal analysis algorithm constructed circuit equations. With the aim to couple the two subsystems together, a lumped port is defined over a coaxial surface between the via barrel and the ground plane. To reach the coupling from the field to the circuit subsystem, a lumped voltage source calculated by the integration of electric field along the radial direction is introduced. On the other hand, to facilitate the coupling from the circuit to field subsystem, a lumped port current source calculated from the circuit equation is introduced, which serves as an impressed current source for the field subsystem. With these two auxiliary terms, a hybrid field-circuit matrix equation is established, which enables the field and circuit subsystems are solved in a synchronous scheme. Furthermore, the arbitrarily shaped antipads are considered by enforcing the proper wave port excitation using the magnetic surface current source derived from the antipads supported electric eigenmodes. In this way, the S-parameters corresponding to different modes can be conveniently extracted. To further improve the efficiency of the proposed algorithm in handling multiscale meshes, the local time-stepping marching scheme is applied. The proposed algorithm is verified by several representative examples.
Original languageEnglish (US)
Pages (from-to)1476-1485
Number of pages10
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Volume7
Issue number9
DOIs
StatePublished - Mar 22 2017

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