Differential RF MEMS interwoven capacitor immune to residual stress warping

Amro M. Elshurafa, Khaled N. Salama

Research output: Contribution to journalArticlepeer-review

2 Scopus citations

Abstract

A RF MEMS capacitor with an interwoven structure is designed, fabricated in the PolyMUMPS process and tested in an effort to address fabrication challenges usually faced in MEMS processes. The interwoven structure was found to offer several advantages over the typical MEMS parallel-plate design including eliminating the warping caused by residual stress, eliminating the need for etching holes, suppressing stiction, reducing parasitics and providing differential capability. The quality factor of the proposed capacitor was higher than five throughout a 2–10 GHz range and the resonant frequency was in excess of 20 GHz.
Original languageEnglish (US)
Pages (from-to)658
JournalMicro & Nano Letters
Volume7
Issue number7
DOIs
StatePublished - Jul 25 2012

ASJC Scopus subject areas

  • Biomedical Engineering
  • Bioengineering
  • Materials Science(all)
  • Condensed Matter Physics

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