Deterministic Integration of Out-of-Plane Sensor Arrays for Flexible Electronic Applications

Aftab M. Hussain, Muhammad Mustafa Hussain

Research output: Contribution to journalArticlepeer-review

14 Scopus citations

Abstract

A design strategy for fully flexible electrode arrays with out-of-plane through polymer vias (TPVs) for monolithic 3D integration of sensor readout circuitry is presented. The TPVs are formed using copper embedded in thin polyimide structure for support. The copper interconnects offer a stable impedance frequency response from DC to 100 kHz (Z ≈ 20 Ω, θ ≈ 0°).
Original languageEnglish (US)
Pages (from-to)5141-5145
Number of pages5
JournalSmall
Volume12
Issue number37
DOIs
StatePublished - Jul 25 2016

Fingerprint Dive into the research topics of 'Deterministic Integration of Out-of-Plane Sensor Arrays for Flexible Electronic Applications'. Together they form a unique fingerprint.

Cite this