The feasibility of a miniaturized ACS was demonstrated by using advanced microfabrication techniques. In particular, it was shown that silicon dry etching conditions can be adjusted in order to get surfaces with a roughness of 100 nm or less.
|Original language||English (US)|
|Number of pages||5|
|Journal||Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures|
|State||Published - Nov 2002|
ASJC Scopus subject areas
- Condensed Matter Physics
- Electrical and Electronic Engineering