Dendrimers with thermally labile end groups: An alternative approach to chemically amplified resist materials designed for sub-100 nm lithography

David C. Tully, Alexander R. Trimble, Jean Frechet

Research output: Contribution to journalArticlepeer-review

101 Scopus citations

Abstract

Chemically amplified resist (CAR) technology continues to be one of the most promising candidates for the next generation of lithographic resist materials capable of imaging feature sizes below 100 nm. The extremely high sensitivity of CARs relies almost entirely on the chemistry of photoacid catalysis, whereby a single radiation event can induce the chemical transformation of hundreds of species. In this context, the role of polymer architecture in lithographic imaging was studied at these small feature sizes.

Original languageEnglish (US)
Pages (from-to)1118-1122
Number of pages5
JournalAdvanced Materials
Volume12
Issue number15
DOIs
StatePublished - Aug 2 2000

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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