TY - JOUR
T1 - Deep Ultraviolet Copper(I) Thiocyanate (CuSCN) Photodetectors Based on Coplanar Nanogap Electrodes Fabricated via Adhesion Lithography
AU - Wyatt-Moon, Gwenhivir
AU - Georgiadou, Dimitra G
AU - Semple, James
AU - Anthopoulos, Thomas D.
N1 - KAUST Repository Item: Exported on 2020-10-01
Acknowledgements: G.W.M. and T.D.A. acknowledge the Engineering and Physical Sciences Research Council (EPSRC) grant no. EP/G037515/1. D.G.G. and T.D.A. acknowledge financial support from the European Union’s Horizon 2020 research and innovation programme (under the Marie Skłodowska-Curie grant agreement 706707).
PY - 2017/11/27
Y1 - 2017/11/27
N2 - Adhesion lithography (a-Lith) is a versatile fabrication technique used to produce asymmetric coplanar electrodes separated by a
AB - Adhesion lithography (a-Lith) is a versatile fabrication technique used to produce asymmetric coplanar electrodes separated by a
UR - http://hdl.handle.net/10754/626275
UR - http://pubs.acs.org/doi/10.1021/acsami.7b12942
UR - http://www.scopus.com/inward/record.url?scp=85037686143&partnerID=8YFLogxK
U2 - 10.1021/acsami.7b12942
DO - 10.1021/acsami.7b12942
M3 - Article
C2 - 29172422
AN - SCOPUS:85037686143
VL - 9
SP - 41965
EP - 41972
JO - ACS Applied Materials & Interfaces
JF - ACS Applied Materials & Interfaces
SN - 1944-8244
IS - 48
ER -