Decal Electronics: Printable Packaged with 3D Printing High-Performance Flexible CMOS Electronic Systems

Galo T. Sevilla, Marlon Diaz, Joanna M. Nassar, Amir Hanna, Arwa T. Kutbee, Armando Arpys Arevalo Carreno, Muhammad Mustafa Hussain

Research output: Contribution to journalArticlepeer-review

9 Scopus citations

Abstract

High-performance complementary metal oxide semiconductor electronics are flexed, packaged using 3D printing as decal electronics, and then printed in roll-to-roll fashion for highly manufacturable printed flexible high-performance electronic systems.
Original languageEnglish (US)
Pages (from-to)1600175
JournalAdvanced Materials Technologies
Volume2
Issue number1
DOIs
StatePublished - Oct 13 2016

Bibliographical note

KAUST Repository Item: Exported on 2020-10-01
Acknowledged KAUST grant number(s): BAS/1/1619-01-01
Acknowledgements: This publication was based upon work supported by the King Abdullah University of Science and Technology (KAUST) Office of Sponsored Research (OSR) under Award No. BAS/1/1619-01-01. The authors are deeply grateful to Prof. Sigurdur T. Thoroddsen for the 3D printing resources made available to the authors in his High Speed Imaging Lab of KAUST. The authors also thank Seneca J. Velling, Visiting Undergradaute Research Intern from the University of Waterloo for proof reading the manuscript.

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