Crack spacing in brittle films on dissimilar planar and axisymmetric elastic substrates

R. Nahta*, Brian Moran

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

21 Scopus citations

Abstract

The phenomenon of multiple cracking in brittle films on dissimilar elastic substrates is analyzed using a fracture mechanics approach. Film cracking is based on an energy release rate criterion. Energy release rates are calculated using finite elements and the domain integral method. Both planar and axisymmetric configurations are considered. Crack spacing curves are obtained as a function of applied load for a range of materials and geometric parameters. These curves may be used to determine the film fracture toughness if either the crack initiation stress or crack spacing is measured experimentally. The results obtained are applicable to the cases of mechanical or residual stress induced cracking in thin films and to the tensile test of a thin coated fiber.

Original languageEnglish (US)
Pages (from-to)513-524
Number of pages12
JournalEngineering Fracture Mechanics
Volume52
Issue number3
DOIs
StatePublished - Jan 1 1995

ASJC Scopus subject areas

  • Mechanical Engineering
  • Mechanics of Materials
  • Materials Science(all)

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